Speeding up and improving SMD assembly with Vogt products
For production service providers for electronic components (EMS – electronic manufacturing services), one of the key goals is to shorten production time and ensure that PCB equipment offers quality that lasts, naturally taking the highest possible in-house productivity levels into account.
EMS providers, who often work in the OEM business, need to be flexible when it comes to assembling SMDs (surface-mounted devices). Their flexibility is often put to the test by frequent product changes being made to the SMD modules and by fluctuating utilisation.
Increasing automation in the assembly process
When compared to other types of assembly, such as the use of THT (through-hole technology) elements, the quantity of SMD assembly operations has been growing steadily for years – not least due to automation in the assembly process. Using SMD elements helps to miniaturise electronic assemblies and, above all else, enables quick and precise automatic equipment of printed circuit boards, even on both sides.
But increasing automation hasn’t stopped either when it comes to placement of THT elements, which still have their place on the market because, depending on their type and properties, they take up less space on printed circuit boards and can also withstand higher mechanical loads. Many printed circuit boards contain components that integrate both SMD and THT assembly technologies.
The PiP (pin-in-paste) production process capitalises on the reflow soldering process originally designed for SMT (surface mount technology). Originally, placing THT elements was very much a manual process. An automated PiP production process now allows both connection technologies (SMT / THT) to be processed using the same equipment in a single work step. The reflow heat resistance of the elements to be soldered is a crucial factor. The fact that less effort is needed during manual assembly work and that the elements are mounted in a space-saving manner thanks to smaller distances between components and solder joints means that end customers, for example, can benefit from cut costs and a high level of end product quality in embedded computer module production.
Ready for fully automated assembly – with Vogt components on blister tapes
As printed circuit boards are increasingly being equipped in fully automatic processes, Vogt offers various SMD components, including the likes of contact springs, screw fasteners, fuse holders or plug-in tongues, which also come in refined variants, whether they’re pure tin-plated, tin-plated for the reflow soldering process, or even gold-plated. At Vogt AG, individual customer requests or adaptations to standard SMD or THT elements are limitless. Since we have our own stamping plant, stamped and bent parts can also be customised in terms of shape and application and, if desired, can also be specially coated or extrusion-coated with plastic. Our Sales department will be more than happy to assist you with any enquiries you might have or advice you might require.
Corresponding tape and reel component packaging, to name but one example, is required to automatically feed SMD or THT components to an automatic assembly machine. Vogt AG uses a variety of automatic blister machines featuring a camera unit that also checks the position of asymmetrical parts if necessary and packs the components correctly and automatically on blister tapes and reels. So, if they make use of automated SMD or THT component assembly, there’s nothing more stopping customers from cutting costs.
- Tags: Assembling, Automation, blister, Customer specific. ReflowSMD, EMS, Hybrid, Individual solution, Tape-and-Reel, THT
Autor: Tobias Haarmann
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