In terms of leadfree soldering, many of our customers have encountered some uncertainties and thus have questions regarding aforementioned. The optimum soldering profile (a thermal profile) for reflow and wave soldering is especially in demand today. 

The company Vogt AG Verbindungstechnik is a manufacturer of mechanical elements. Our core competence does not comprise the soldering process. Since 1995 products delivered by us meet the requirements of today’s  law regarding the defined hazardous substances in the electrical appliances and equipment. The surfaces have also only been tin-plated with leadfree materials (Sn 100%, Ag 100% etc.).

Experience has shown that the application of new leadfree solder  (Sn-Ag-Cu, Sn-3.7Ag, Sn -0.7 Cu etc.) called for respective modifications of limit values in temperature and time.  It must also be mentioned here that the part geometry also plays an important role. The values depend on the heat requirement and heat transfer during the soldering process.

In order to attain the optimal soldering profile, we advise you to consult the soldering machine supplier.  

We have compiled an overview of up-to-date scientific publications with respect to the optimum soldering profiles. This information may give you the support you need when searching for your solution.

		J-STD-020C "Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices"
		Bulletin SEV/VSE 17/04; Guido Santner „Jetzt mit bleifrei beginnen“ Interview
		Bulletin SEV/VSE 17/04; Günter Grossmann „Bleifreies Löten: Technik ist bereit“
		Poech, Max Hermann und Bell, Hans: Gibt es ein optimales Reflowprofil? DVS/GMM Fachtagung 6./7. Februar 2002, Fellbach; GMM Fachbericht 37, VDE Verlag GmbH Berlin 2002

Compilation: Elena Raetz (Dipl. Ing, Q/UM/AS-Koordinatorin)